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NCP2811 NOCAPt Advanced Stereo Headphone Amplifier
NCP2811 is a dual audio power amplifier designed for portable communication device applications such as mobile phones. This part is capable of delivering 27 mW of continuous average power into a 16 load from a 2.7 V power supply with a THD+N of 1%. Based on the power supply delivered to the device, an internal power management block generates a symmetrical positive and negative voltage. Thus, the internal amplifiers provide outputs referenced to Ground. In this True Ground configuration, the two external heavy coupling capacitors can be removed. It offers significant space and cost savings compared to a typical stereo application. NCP2811 is available with an external adjustable gain (version A), or with an internal gain of -1.5 V/V (version B). It reaches a superior -100 dB PSRR and noise floor. Thus, it offers high fidelity audio sound, as well as a direct connection to the battery. It contains circuitry to prevent from "Pop & Click" noise that would otherwise occur during turn-on and turn-off transitions. The device is available in 12 bump CSP package (2 x 1.5 mm) which help to save space on the board. It is also available in WQFN12 and TSSOP-14 packages.
Features
1
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12 PIN CSP FC SUFFIX CASE 499AZ = A for NCP2811A = B for NCP2811B A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package x 2811x AYWW G
* True Ground Configuration Output Eliminates DC-Blocking
WQFN12 MT SUFFIX CASE 510AH x A L Y W G = A for NCP2811A = B for NCP2811B = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
2811x ALYWG G
* * * * * * * * * *
Capacitors: - Save Board Area - Save Component Cost - No Low-Frequency Response Attenuation High PSRR (-100 dB): Direct Connection to the Battery "Pop and Click" Noise Protection Circuitry Internal Gain (-1.5 V/V) or External Adjustable Gain Ultra Low Current Shutdown Mode 2.7 V - 5.0 V Operation Thermal Overload Protection Circuitry CSP 2 x 1.5 mm WQFN12 3 x 3 mm TSSOP-14 These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
(Note: Microdot may be in either location) 14 14 1 TSSOP-14 DTB SUFFIX CASE 948G 1 x A L Y W G = A for NCP2811A = B for NCP2811B = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
2811 x ALYWG G
Typical Applications
* Headset Audio Amplifier for
- Cellular Phones - MP3 Player - Personal Digital Assistant and Portable Media Player - Portable Devices
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 12 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2009
October, 2009 - Rev. 2
1
Publication Order Number: NCP2811/D
NCP2811
1 mF CPM CPP 1 mF VP 1 mF VP 1 mF CPM TSSOP14 NC VP CPP PGND CPM PVM SD (Top View) OUTL OUTR NC INR AGND INL NC CPP
Audio Left SD Audio Right
C3 1 mF C2 PGND C4 PVM PVM B3 INL SPVM B4 A2 10 OUTL SD A4 B2 OUTL INR A3 OUTR OUTR AGND 10 A version A1 CPP CPM
Figure 1. Application Schematics
WQFN12 12 PIN CSP A1 AGND B1 VP C1 CPP A2 SD B2 INR C2 A3 B3 INL C3 A4 B4 SPVM C4 PVM PVM SD INL CPP PGND CPM NC INR AGND VP OUTL OUTR
OUTR OUTL
PGND CPM (Top View)
(Top View)
Figure 2. Pin Configurations
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2
CPP CPM
B1 C1 VP
C3 1 mF C2 PGND C4 PVM PVM Audio Left B3 INL SPVM B4 SD A2 SD A4 10 OUTL OUTL Audio Right B2 INR OUTR A3 OUTR AGND 10 A1 B version
B1 C1 VP
NCP2811
VP Cs
1 mF
1 mF
VP VRP POWER MANAGEMENT VRM Left Audio CPP CPM PGND PVM SPVM
1 mF
VRP INL
-
+
OUTL
VRM SD BIASING CLICK/POP SUPPRESSION VRP Right Audio INR
+
Use 10 ohm resistor for capacitive drive capability
OUTR
-
VRM AGND
Figure 3. Typical Application Schematic version A
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NCP2811
VP Cs
1 mF
1 mF
VP VRP POWER MANAGEMENT VRM Left Audio INL
-
CPP
CPM PGND PVM
1 mF
VRP
+
OUTL VRM
SD
BIASING
CLICK/POP SUPPRESSION VRP
Use 10 ohm resistor for capacitive drive capability
Right Audio INR
+
OUTR
-
VRM AGND
Figure 4. Typical Application Schematic version B Table 1. PIN FUNCTION DESCRIPTION
PIN CSP A1 A2 A3 A4 B1 B2 B3 B4 C1 C2 C3 C4 PIN TQFN 7 5 10 11 12 8 6 - 1 2 3 4 PIN TSSOP 10 7 13 14 2 11 9 - 3 4 5 6 PIN NAME AGND SD OUTR OUTL VP INR INL SPVM CPP PGND CPM PVM TYPE GROUND INPUT OUTPUT OUTPUT POWER INPUT INPUT POWER INPUT/ OUTPUT GROUND INPUT OUTPUT DESCRIPTION Analog ground. Connect to ground reference Enable activation Right audio channel output signal Left audio channel output signal Positive supply voltage. It can be connected for example to a Lithium/Ion battery Right input of the first audio source Left input of the first audio source Amplifier negative power supply voltage. Connect to PVM Charge pump flying capacitor positive terminal. A 1 mF ceramic filtering capacitor to CPM is needed Power ground, connect to ground reference Charge pump flying capacitor negative terminal. A 1 mF ceramic filtering capacitor to CPP is needed Charge pump output. A 1 mF ceramic filtering capacitor to ground is needed
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NCP2811
Table 2. MAXIMUM RATINGS
Rating AVIN, PVIN Pins: Power Supply Voltage (Note 2) INL, INR Pins: Input (Note 2) A version B version SD Pin: Input (Note 2) Human Body Model (HBM) ESD Rating are (Note 3) Machine Model (MM) ESD Rating are (Note 3) CSP 1.5 x 2.0 mm package (Notes 6 and 7) Thermal Resistance Junction to Case Operating Ambient Temperature Range Operating Junction Temperature Range Maximum Junction Temperature (Note 6) Storage Temperature Range Moisture Sensitivity (Note 5) Symbol VP VIN -VP - 0.3 to VP + 0.3 -2 to +2 VYY ESD HBM ESD MM RqJC TA TJ TJMAX TSTG MSL -0.3 to VP + 0.3 2000 200 (Note 7) -40 to + 85 -40 to + 125 + 150 -65 to + 150 Level 1 V V V C/W C C C C Value - 0.3 to + 6.0 Unit V V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Notes: 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25C. 2. According to JEDEC standard JESD22-A108B. 3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) 2.0 kV per JEDEC standard: JESD22-A114 for all pins. Machine Model (MM) 200 V per JEDEC standard: JESD22-A115 for all pins. 4. Latch up Current Maximum Rating: 100 mA per JEDEC standard: JESD78 class II. 5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J-STD-020A. 6. The thermal shutdown set to 150C (typical) avoids irreversible damage on the device due to power dissipation. 7. The RJA is highly dependent of the PCB Heatsink area. For example, RJA can equal 195C/W with 50 mm2 total area and also 135C/W with 50 mm2. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation.
R qCA +
125 * T A * R qJC PD
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NCP2811
Table 3. ELECTRICAL CHARACTERISTICS Min & Max Limits apply for TA between -40C to +85C and TJ up to + 125C for VIN
between 2.7 V to 5.0 V (Unless otherwise noted). Typical values are referenced to TA = + 25C and VIN = 3.6 V. Symbol VP IDD ISD VOS VIH VIL RSD TWU TSD VLP Parameter Operational Power Supply Supply quiescent current Shutdown current Output offset voltage High-Level input voltage SD pin Low-Level input voltage SD pin SD pin pull-down impedance Turning on time Thermal shutdown temperature Max output swing (peak value) VP = 2.9 V to 5.0 V Headset 16 W THD+N = 1% VP = 2.7V, THD+N = 1% Headset = 16 W VP = 2.7V, THD+N = 1% Headset = 32 W VP = 3.6V, THD+N = 1% Headset = 16 W VP = 3.6V, THD+N = 1% Headset = 32 W VP = 5.0V, THD+N = 1% Headset = 16 W VP = 5.0V, THD+N = 1% Headset = 32 W Headset 16 W VP = 2.7 V to 5.0 V Input shorted to ground F = 217 Hz F = 1 kHz Headset = 16 W POUT = 25 mW A-Weighting filter B version only 1 190 1 160 Both channels enabled VP = 2.7 V to 5.0 V VP = 2.7 V to 5.0 V 1.2 0.4 1 Conditions Min 2.7 6.0 1 Typ Max 5.0 Unit V mA mA mV V V KW ms C VRMS
PO
Max output power (output in phase)
27 37 90 64 110 64 -80 -60
mW
Crosstalk (Note 8) PSRR Power supply rejection ratio (Note 8)
dB dB
-106 -95 0.01 7 20 10 % mVRMS KW KW V mV -1.48 V/V
THD+N VN ZIN ZSD UVLO UVLOHYST Av
Total harmonic distortion + noise (Note 8) Output noise voltage (Note 8) Input impedance Output impedance in shutdown mode UVLO threshold UVLO hysteresis Voltage Gain
Falling edge
2.3 100
B version only
-1.53
-1.5
8. Guaranteed by design and characterized.
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NCP2811
TYPICAL OPERATING CHARACTERISTICS
100 16 W in Phase 10 1 0.1 0.01 0.001 THD+N (%) THD+N (%) 10 1 0.1 0.01 THD+N_R (%) 0 20 40 60 80 Pout (mW) 100 120 140 160 0.001 0 20 40 60 80 100 120 140 160 180 THD+N_L (%) 100 16 W out of Phase
THD+N_L (%) THD+N_R (%)
Pout (mW)
Figure 5. THD+N vs. Pout @ Vp = 3.6 V
100 10 1 0.1 0.01 0.001 100 10 3.0 V THD (%) THD (%) 3.6 V 1 0.1 0.01 0.001
Figure 6. THD+N vs. Pout @ Vp = 3.6 V
16 W in Phase 2.7 V
16 W out of Phase 2.7 V 3.0 V 3.6 V 4.2 V Vp = 5 V
4.2 V Vp = 5 V
0
20
40
60
80
100
120
140
160
180
0
20
40
60
80
100
120
140
160 180
Pout (mW)
Pout (mW)
Figure 7. THD+N vs. Pout LEFT
100 10 1 0.1 0.01 0.001 100 2.7 V
Figure 8. THD+N vs. Pout RIGHT
16 W out of Phase 3.0 V 3.6 V 4.2 V Vp = 5 V
16 W out of Phase 10 1 0.1 0.01 0.001
2.7 V 3.0 V 3.6 V 4.2 V Vp = 5 V
THD (%)
0
20
40
60
80
100
120
140
160
THD (%)
180
0
20
40
60
80
100
120
140
160 180
Pout (mW)
Pout (mW)
Figure 9. THD+N vs. Pout LEFT
Figure 10. THD+N vs. Pout RIGHT
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NCP2811
TYPICAL OPERATING CHARACTERISTICS
100 10 1 THD+N_R (%) 0.1 0.01 0.001 THD+N (%) THD+N (%) THD+N_L (%) 32 W in Phase 100 10 THD+N_L (%) 1 THD+N_R (%) 0.1 0.01 0.001 32 W out of Phase
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90 100
Pout (mW)
Pout (mW)
Figure 11. THD+N vs. Pout @ Vp = 3.6 V
100 10 1 0.1 0.01 0.001 100 2.7 V 3.0 V 3.6 V 4.2 V Vp = 5 V 10 1 0.1 0.01 0.001
Figure 12. THD+N vs. Pout @ Vp = 3.6 V
32 W in Phase
32 W in Phase 2.7 V 3.0 V 3.6 V 4.2 V Vp = 5 V
THD (%)
0
10
20
30
40
50
60
70
80
90
100
THD (%)
0
10
20
30
40
50
60
70
80
90 100
Pout (mW)
Pout (mW)
Figure 13. THD+N vs. Pout LEFT
100 32 W out of Phase 10 1 0.1 0.01 0.001 2.7 V THD (%) 3.0 V 3.6 V 4.2 V Vp = 5 V 10 1 0.1 0.01 0.001 100
Figure 14. THD+N vs. Pout RIGHT
32 W out of Phase 2.7 V 3.0 V 3.6 V 4.2 V Vp = 5 V
THD (%)
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90 100
Pout (mW)
Pout (mW)
Figure 15. THD+N vs. Pout LEFT
Figure 16. THD+N vs. Pout RIGHT
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NCP2811
TYPICAL OPERATING CHARACTERISTICS
1 16 W out of Phase 1 16 W out of Phase
THD+N (%)
THD+N (%)
0.1
VP = 3.6 V VP = 5.0 V
0.1
VP = 3.6 V 0.01 VP = 2.7 V VP = 5.0 V
0.01
VP = 2.7 V
0.001
10
100
1,000 FREQUENCY (Hz)
10,000
100,000
0.001
10
100
1,000 FREQUENCY (Hz)
10,000
100,000
Figure 17. THD vs. Frequency LEFT @ Pout = 32 mW
1 32 W out of Phase VP = 2.7 V THD+N (%) THD+N (%) 0.1 VP = 3.6 V VP = 5.0 V 0.1 1
Figure 18. THD vs. Frequency RIGHT @ Pout = 32 mW
32 W out of Phase VP = 2.7 V VP = 3.6 V VP = 5.0 V
0.01
0.01
0.001
10
100
1,000 FREQUENCY (Hz)
10,000
100,000
0.001
10
100
1,000 FREQUENCY (Hz)
10,000
100,000
Figure 19. THD vs. Frequency LEFT @ Pout = 32 mW
140 120 100 (mW) 80 -40C 60 40 20 0 2.7 3.2 3.7 VP (V) 4.2 4.7 85C (mW) 25C 80 70 60 50 40 30 20 10 0 2.7
Figure 20. THD vs. Frequency RIGHT @ Pout = 32 mW
85C 25C
-40C
3.2
3.7 VP (V)
4.2
4.7
Figure 21. Maximum Output Power LEFT vs. VP (THD+N < 1%)
Figure 22. Maximum Output Power LEFT vs. VP (THD+N < 0.1%)
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NCP2811
TYPICAL OPERATING CHARACTERISTICS
0 -20 -40 -60 -80 NCP2811B Left -100 -120 NCP2811B Right 10 100 1000 FREQUENCY (Hz) 10,000 100,000 (dB) -60 -65 -70 -75 PSRR (dB) -80 -85 -90 -95 -100 -105 -110 -115 -120 Right to Left Left to Right
10
100
1000 FREQUENCY (Hz)
10,000
100,000
Figure 23. PSRR at Vp = 3.6 V
Figure 24. Crosstalk vs. Frequency @ Vp = 3.6 V
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NCP2811
DETAIL OPERATING DESCRIPTION
Detailed Descriptions
The NCP2811 is a stereo headphone amplifier with a true ground architecture. This architecture eliminates the need to use 2 external big capacitors required by conventional headphone amplifier. The structure of the NCP2811 is basically composed of 2 true ground amplifiers, an UVLO, a short circuit protection and also a thermal shutdown. A special circuitry is embedded to eliminate any pop and click noise that occurs during turn on and turn off time. The A version has an external gain selectable by two resistor, B version has a gain of 1.5 V/V.
NOCAPt
filter with Rin (externally selectable for A version, 20 kW for B version). The size of the capacitor must be large enough to couple in low frequencies without severe attenuation in the audio bandwith (20 Hz - 20 kHz). The cut off frequency for the input high-pass filter is:
Fc + 1 2pR inC in
A Fc < 20 Hz is recommended.
Charge Pump Capacitor Selection
NOCAPt is a patented architecture which requires only 2 small ceramic capacitors. It generates a symmetrical positive and negative voltage and it allows the output of the amplifiers to be biased around the ground.
Current Limit Protection Circuit
The NCP2811 embed a protection circuitry against short to ground. When an output is shorted to GND and when a signal appears at the input, the current is limited to 300 mA.
Thermal Overload Protection
Use ceramic capacitor with low ESR for better performances. X5R / X7R capacitor is recommended. The flying capacitor (C2) serves to transfer charge during the generation of the negative voltage. The CPVM capacitor (C3) must be equal at least to the CFly capacitor to allow maximum transfer charge. The CPVM value must not exceed 1 mF. Higher capacitor value can damage the part. Table 4 suggests typical value and manufacturer:
Table 4.
Value 1 mF 1 mF Reference C1005X5R0J105K GRM155R60J105K19 Package 0402 0402 Manufacturer TDK Murata
Internal amplifiers are switched off when the temperature exceed 160C, and will be switch on again when the temperature decrease below 140C.
Under Voltage Lockout
When the battery voltage decreases below 2.3 V, the amplifiers are turned off. The hysteresis to turn on it again is 100 mV.
Pop and Click Suppression Circuitry
Lower value of capacitors can be used but the maximum output power is reduced and the device may not operate to specifications.
Power Supply Decoupling Capacitor (C1)
The NCP2811 includes a special circuitry to eliminate any pop and click noise during turn on and turn off time. Basic amplifier creates an offset during these transitions at the output which give a parasitic noise called "pop and click noise". The NCP2811 eliminates this problem.
Gain Setting Resistor Selection (Rin & Rf, A version only)
The NCP2811 is a True Ground amplifier which requires the adequate decoupling capacitor to reduce noise and THD+N. Use X5R / X7R ceramic capacitor and place it closed to the CPVDD pin. A value of 1 mF is recommended.
Shutdown Function
The device enters in shutdown mode when shutdown signal is low. During the shutdown mode, the DC quiescent current of the circuit does not exceed 500 nA. In this configuration, the output impedance is 10 kW on each output.
Output Resistor for Capacitive Drive Capability
Rin and Rf set the closed loop gain of the amplifier. A low gain configuration (close to 1) minimizes the THD + noise values and maximizes the signal to noise ratio. A closed loop gain in the range of 1 to 10 is recommended to optimize overall system performance. The formula to calculate the gain is:
Av + * Input Capacitor Selection Rf R in
Under normal operation, NCP2811 maximum direct capacitive load is in the 80 pF range. If, for any reason, high value capacitive loads should be connected to NCP2811 outputs, an additional 10 W resistor should be placed between the NCP2811 output and the capacitive load to ensure amplifier stability.
Layout Recommendation
The input coupling capacitor blocks the DC voltage at the amplifier input terminal. This capacitor creates a high-pass
Connect C1 as close as possible of the Vp pin. Connect C2 and C3 as close as possible of the NCP2811. Route audio signal and AGND far from Vp, CPP, CPM, PVM and PGND to avoid any perturbation due to the switching.
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NCP2811
Table 5. ORDERING INFORMATION
Device NCP2811ADTBR2G NCP2811BDTBR2G NCP2811AFCT1G NCP2811BFCT1G NCP2811AMTTXG NCP2811BMTTXG Package TSSOP-14 (Pb-Free) TSSOP-14 (Pb-Free) Flip-Chip 12 (Pb-Free) Flip-Chip 12 (Pb-Free) WQFN12 (Pb-Fre) WQFN12 (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
PACKAGE DIMENSIONS
12 PIN FLIP-CHIP, 2.0x1.5, 0.5P CASE 499AZ-01 ISSUE O
D
PIN A1 REFERENCE 2X
A
B
E 0.10 C
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A A1 A2 b D E e MILLIMETERS MIN MAX 0.60 0.54 0.21 0.27 0.33 0.39 0.29 0.34 2.00 BSC 1.50 BSC 0.50 BSC
2X
0.10 C
TOP VIEW A A2 A1
0.10 C
12X
0.05 C
NOTE 3
SIDE VIEW e/2
C
SEATING PLANE
SOLDERING FOOTPRINT*
A1 0.5 PITCH 0.5 PITCH
12X
b
C B A 1 2 3 4
e
e
12X
0.05 C A B 0.03 C
0.25
PACKAGE OUTLINE
BOTTOM VIEW
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NCP2811
PACKAGE DIMENSIONS
WQFN12 3x3, 0.5P CASE 510AH-01 ISSUE O
L L1 DETAIL A L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.65 0.85 0.00 0.05 0.22 REF 0.20 0.30 3.00 BSC 1.30 1.50 3.00 BSC 1.30 1.50 0.50 BSC 0.20 --- 0.30 0.50 0.00 0.15
D
A
B
2X
0.10 C 0.10 C
TOP VIEW
DETAIL B
A A3
A1
DETAIL B
ALTERNATE CONSTRUCTIONS
13X
0.10 C
NOTE 4
A1 SIDE VIEW
C
SEATING PLANE
DETAIL A 4
D2
12X
PACKAGE OUTLINE
L
1
7
E2
1
12X
b 0.10 C A B 0.05 C
NOTE 3
K
0.30 0.50 PITCH
DIMENSIONS: MILLIMETERS
12X
12
e BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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CC EE EE
EEE CCC CCC
2X
0.10 C
CCC CCC CCC
PIN ONE REFERENCE
E
ALTERNATE CONSTRUCTIONS
EXPOSED Cu
MOLD CMPD
A3
SOLDERING FOOTPRINT*
0.63
12X
1.50 3.30
2X
2X
NCP2811
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE B
14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 --- 1.20 --- 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
N
2X
L/2
14
8
0.25 (0.010) M
L
PIN 1 IDENT. 1 7
B -U-
N F DETAIL E K
0.15 (0.006) T U
S
J J1
SECTION N-N -W-
C 0.10 (0.004) -T- SEATING
PLANE
D
G
H
DETAIL E
SOLDERING FOOTPRINT
7.06 1
0.36
14X
14X
1.26
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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CCC EEE CCC EEE CCC
A -V-
K1
0.65 PITCH
DIMENSIONS: MILLIMETERS
NCP2811/D

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